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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive ray s 1/ 36 www.rohm.com t sz 02201 -09190g100100-1-2 21 .dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. ts z22111 ? 14 ? 001 serial eeprom series standard eeprom microwire bus eeprom (3 -wire) br93g86- 3 general description br 93g86 -3 is serial eeprom of serial 3-line interface method. they are dual organization(by 16bit or 8bit) and it is selected by the input of org pin. features 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared) operations available at high speed 3mhz clock (4.5 v~5.5 v) high speed write available (write time 5ms max. same package and pin configuration from 1kbit to 16kbit 1.7~5.5v single power source operation address auto increment function at read operation write mistake prevention function ? write prohibition at power on ? write prohibition by command code ? write mistake prevention function at low voltage self-timed programming cycle program condition display by ready / busy dual organization : by 16 bit (x16) or 8 bit (x8) compact package sop8/sop-j8/ssop-b8/tssop-b8/msop8/ tssop-b8j/dip-t8/vson008x2030 more than 40 years data retention more than 1 million write cycles initial delivery state all addresses ffffh (x16) or ffh (x8) packages w(typ.) x d(typ.)x h(max.) br 93g86 - 3 capacity bit format type power source voltage package 16 kbit 1024 16 or 2048 8 br93g86-3 1.7v to 5.5v dip- t8 BR93G86F-3 sop8 br93g86fj-3 sop- j8 br93g86fv-3 ssop- b8 br93g86fvt-3 tssop- b8 br93g86fvj-3 tssop-b8j br93g86fvm-3 msop8 br93g86 nux -3 vson008x2030 *1 dip-t8 is not halogen free package sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm vson008x2030 2.00mm x 3.00mm x 0.60mm tssop- b8 3.00mm x 6.40mm x 1.20mm dip- t8 9.30mm x 6.50mm x 7.10mm tssop-b8j 3.00mm x 4.90mm x 1.10mm msop8 2.90mm x 4.00mm x 0.90mm ssop- b8 3.00mm x 6.40mm x 1.35mm datashee t downloaded from: http:///
2/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol ratings unit remarks supply voltage vcc -0.3 to +6.5 v permissible dissipation pd 0. 80 (dip-t8) w when using at ta= 25 or higher 8.0mw to be reduced per 1 . 0.45 (sop8) when using at ta= 25 or higher 4.5mw to be reduced per 1 . 0.45 (sop-j8) when using at ta= 25 or higher 4.5mw to be reduced per 1 . 0. 30 (ssop-b8) when using at ta= 25 or higher 3.0mw to be reduced per 1 . 0. 33 (tssop-b8) when using at ta= 25 or higher 3.3mw to be reduced per 1 . 0. 31 (tssop-b8j) when using at ta= 25 or higher 3.1mw to be reduced per 1 . 0.31 (msop8) when using at ta= 25 or higher 3.1mw to be reduced per 1 . 0. 30 (vson008x2030) when using at ta= 25 or higher 3.0mw to be reduced per 1 . storage temperature tstg 65 to +150 operating temperature topr 40 to +85 input voltage/ output voltage \ -0.3 to vcc+1.0 v the max value of input voltage/output voltage is not over 6.5v . when the pulse width is 50ns or less, the min value of input voltage/output voltage is not under -0.8v. junction temperature tjmax 150 junction temperature at the storage condition memory cell characteristics (vcc=1.7 5.5v) parameter limit unit condition min. typ. max. write cycles *1 1,000,000 - - times ta=25 data retention *1 40 - - years ta=25 shipment data all address ffffh(x16) or ffh(x8) *1 not 100% tested recommended operation rating s parameter symbol limits unit supply voltage vcc 1.7~5.5 v input voltage v in 0~vcc downloaded from: http:///
3/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 dc characteristics (unless otherwise specified, vcc=1.7 5.5v, ta=- 40 +85 ) parameter symbol limits unit condition min. typ. max. input low voltage v il -0.3 *1 - 0.3vcc v 1.7v vcc 5.5v input high voltage v ih 0.7vcc - vcc+1.0 v 1.7v vcc 5.5v output low voltage 1 v ol 1 0 - 0.4 v i ol =2.1 ma , 2.7v vcc 5.5v output low voltage 2 v ol 2 0 - 0.2 v i ol = 10 0 a output high voltage 1 v o h1 2.4 - vcc v i oh =-0.4 ma , 2.7v vcc 5.5v output high voltage 2 v o h2 vcc-0.2 - vcc v i oh =- 100 a input leakage current1 i li 1 -1 - +1 a v in =0 v~vcc(cs,sk,di) input leakage current2 i li 2 -1 - +3 a v in =0 v~vcc(org) output leak age current i lo -1 - +1 a v out =0 v~vcc, cs=0v supply current i cc 1 - - 1.0 ma vcc=1.7v, f sk =1mhz, t e/w =5ms (write) - - 2.0 ma vcc=5.5 v ,f sk =3mhz, t e/w =5ms (write) i cc 2 - - 0.5 ma f sk =1mhz (read) - - 1.0 ma f sk =3mhz (read) i cc 3 - - 2.0 ma vcc=2.5v, f sk =1mhz t e/w =5ms (wral, eral) - - 3.0 ma vcc=5.5v ,f sk =3mhz t e /w =5ms (wral, eral) standby current i sb 1 - - 2.0 a cs=0v, org=vcc or op en i sb 2 - - 15 a cs=0v, org=0v *1 when the pulse width is 50ns or less, the min value of v il is admissible to -0.8v. downloaded from: http:///
4/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ac characteristics (unless otherwise specified, vcc=1.7 ~ 2.5v, ta=- 40 ~ +85 ) parameter symbol limits unit min. typ. max. sk frequency f sk - - 1 mhz sk high time t skh 250 - - ns sk low time t skl 250 - - ns cs low time t cs 250 - - ns cs setup time t c ss 200 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data 1 output delay t pd1 - - 400 ns data 0 output delay t pd0 - - 400 ns time from cs to output establishment t sv - - 400 ns time from cs to high-z t df - - 200 ns write cycle time t e/w - - 5 ms (unless otherwise specified, vcc=2.5~4.5v, ta=-40~+85 ) parameter symbol limits unit min. typ. max. sk frequency f sk - - 2 mhz sk high time t skh 230 - - ns sk low time t skl 200 - - ns cs low time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data 1 output delay t pd1 - - 200 ns data 0 output delay t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 100 ns write cycle time t e/w - - 5 ms (unless otherwise specified, vcc=4.5~5.5v, ta=-40~+85 ) parameter symbol limits unit min. typ. max. sk frequency f sk - - 3 mhz sk high time t skh 100 - - ns sk low time t skl 100 - - ns cs low time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 50 - - ns cs hold time t csh 0 - - ns di hold time t dih 50 - - ns data 1 output delay t pd1 - - 200 ns data 0 output delay t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 100 ns write cycle time t e/w - - 5 ms downloaded from: http:///
5/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 serial input / output timing data is taken by di sync with the rise of sk. at read operation, data is output from do in sync with the rise of sk. the status signal at write (ready / busy) is output after t cs from the fall of cs after write command input, at the area do where cs is high, and valid until the next command start bit is input. and, while cs is low , do becomes high- z. after completion of each mode execution, set cs low once for inte rnal circuit reset, and execute the following operation mode. 1/f sk is the sk clock cycle, even if f sk is maximum, the sk clock cycle can t be t skh (min.)+t skl (min.) for write cycle time t e/w , please see figure 36,37,39,40. for cs low time t cs , please see figure 36,37,39,40. block diagram figure 1. sync data input / output timing cs sk do(read) di do(write) t css t skh t skl t csh t dis t d ih t pd1 t pd0 t df status valid t sv 1/ f sk command decode control clock generation power source voltage detection write prohibition high voltage occurrence command register address buffer sk di dummy bit do data register r/w amplifier 10 bit or 11bit 10 bit or 11bit 16bit/8bit 16bit/8bit 16 , 384 bit eeprom cs address decoder org figure 2 . block diagram downloaded from: http:///
6/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pin configuration pin descriptions figure 3 . pin configuration pin name i / o function cs input chip select input sk input serial clock input di input start bit, ope code, address, and serial data input do output serial data output, ready / busy DDDDD status display output gnd - all input / output reference voltage, 0v org input organization select, x16mode or x8 mode *1 du - dont use terminal *2 vcc - supply voltage *1 the memory array organization may be divided into either x8 or x16 which is selected by pin org. when org is open or connected to vcc, x16 organization is selected. when org is connected to ground, x8 organization is selected. *2 terminals not used may be set to any of high,low, and open v cc du org gnd cs sk di do br93g 86 -3 :dip- t8 br93g 86 f-3 :sop8 br93g 86 fj -3 :sop- j8 br93g 86 fv -3 :ssop- b8 br93g 86 fvt-3 :tssop- b8 br93g 86 fvj-3 :tssop-b8j br93g 86 fvm-3 :msop8 br93g 86 nux -3 :vson008x2030 downloaded from: http:///
7/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves figure 4 . i nput high voltage v ih (cs,sk,di,org) figure 5 . i nput low voltage v il (cs,sk,di,org) figure 6 . output low voltage1 v ol 1 (vcc=2.7v) figure 7 . output low voltage2 v ol 2 (vcc=1.7v) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) input high voltage : v ih (v) spec ta=-0 ta= 2 ta= 8 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) input low voltage : v il (v) spec ta=-0 ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 output low current:i ol (ma) output low voltage1 : v ol1 (v) spec ta=-0 ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 output low current : i ol (ma) output low voltage2 : v ol2 (v) spec ta=-0 ta= 2 ta= 8 downloaded from: http:///
8/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued figure 8 . output high voltage1 v oh 1 (v cc= 2.7v) figure 9 . o utput high voltage2 v oh 2 (vcc=1.7v) 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current1 : i li1 (ua) spec ta=-0 ta= 2 ta= 8 0 1 2 3 4 5 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current2 : i li2 (ua) spec ta=-0 ta= 2 ta= 8 figure 10 . input leakage current1 i li1 (cs,sk,di) figure 11 . input leakage current2 i li2 (org) 0 1 2 3 4 5 0 0.4 0.8 1.2 1.6 output high current: i oh (ma) output high voltage1 : v oh1 (v) spec ta=-0 ta= 2 ta= 8 0 1 2 3 4 0 0.4 0.8 1.2 1.6 output high current: i oh (ma) output high voltage2 : v oh2 (v) spec ta=-0 ta= 2 ta= 8 downloaded from: http:///
9/ 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) output leakage current : i lo (ua) spec ta=-0 ta= 2 ta= 8 0 1 2 3 4 5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (write) : i cc1 (ma) spec ta=-0 ta= 2 ta= 8 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (read) : i cc2 (ma) spec ta=-0 ta= 2 ta= 8 figure 12 . output leakage current i lo (do) figure 13. supply current (write) i cc1 (write, f sk =1mhz) figure 14. supply current (write) i cc1 (write,f sk =3mhz) figure 15. supply current (read) i cc2 (read,f sk =1mhz) 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (write) : i cc1 (ma) spec ta=-0 ta= 2 ta= 8 downloaded from: http:///
10 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (read) : i cc2 (ma) spec ta=-0 ta= 2 ta= 8 0 1 2 3 4 5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (wral) : i cc3 (ma) spec ta=-0 ta= 2 ta= 8 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) standby current : i sb1 (ua) spec ta=-0 ta= 2 ta= 8 figure 16. supply current (read) i cc2 (read,f sk =3mhz) figure 17. supply current (wral) i cc3 (wral,f sk =1mhz) figure 18. supply current (wral) i cc3 (wral,f sk =3mhz) figure 19. standby current i sb1 (cs=0v, org=vcc or open) 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (wral) : i cc3 (ma) spec ta=-0 ta= 2 ta= 8 downloaded from: http:///
11 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued 0 5 10 15 20 0 1 2 3 4 5 6 supply voltage: vcc(v) standby current : i sb2 (ua) spec ta=-0 ta= 2 ta= 8 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) sk high time : t skh (ns) spec ta=-0 ta= 2 ta= 8 spec spec figure 20 . standby current i sb2 (cs=0v, org=0v) figure 21 . sk frequency f sk figure 22 . sk high time t skh figure 23 . sk low time t skl 0.01 0.1 1 10 100 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) sk frequency : f sk (mhz) spec ta=-0 ta= 2 ta= 8 spec spec 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) sk low time : t skl (ns) spec ta=-0 ta= 2 ta= 8 spec spec downloaded from: http:///
12 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued -300 -250 -200 -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage: vcc(v) cs hold time : t csh (ns) spec ta=-0 ta= 2 ta= 8 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) cs low time : t cs (ns) spec ta=-0 ta= 2 ta= 8 spec 0 50 100 150 200 250 300 0 1 2 3 4 5 6 supply voltage: vcc(v) cs setup time : t css (ns) spec ta=-0 ta= 2 ta= 8 spec -50 0 50 100 150 0 1 2 3 4 5 6 supply voltage: vcc(v) di setup time : t dis (ns) spec ta=-0 ta= 2 ta= 8 spec figure 24 . cs low time t cs figure 25 . cs hold time t csh figure 26 . cs setup time t css figure 27 . di setup time t dis downloaded from: http:///
13 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued -50 0 50 100 150 0 1 2 3 4 5 6 supply voltage: vcc(v) di hold time : t dih (ns) spec ta=-0 ta= 2 ta= 8 spec 0 200 400 600 800 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) data "0" output delay : t pd0 (ns) spec ta=-0 ta= 2 ta= 8 spec 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) time from cs to output establishment : t sv (ns) spec ta=-0 ta= 2 ta= 8 spec figure 28 . di hold time t dih figure 29 . data "0" output delay t pd0 figure 30 . data "1" output delay t pd1 figure 31 . time from cs to output establishment t sv 0 200 400 600 800 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) data "1" output delay : t pd1 (ns) spec ta=-0 ta= 2 ta= 8 spec downloaded from: http:///
14 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued 0 50 100 150 200 250 0 1 2 3 4 5 6 supply voltage: vcc(v) time from cs to high-z : t df (ns) spec ta=-0 ta= 2 ta= 8 spec 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) write cycle time : t e/w (ms) spec ta=-0 ta= 2 ta= 8 figure 32 . time from cs to high-z t df figure 33 . write cycle time t e/w downloaded from: http:///
15 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 description of operations communications of the microwire bus are carried out by sk (serial c lock), di (serial data input),do (serial data output) ,and cs (chip select) for device selection. when to connect one eeprom to a microcontroller, connect it as shown in figure 34 (a) or figure 34 (b). when to use the input and output common i/o port of the microcontroller, connec t di and do via a resistor as shown in figure 34 (b) (refer to pages 21 , 22 . ), and connection by 3 lines is available. in the case of plural connections, refer to figure 34 (c). communications of the microwire bus are started by the first 1 input after the rise of cs. this input is called a start bit. after input of the start bit, input ope code, address and data. addres s and data are input all in msb first manners. 0 input after the rise of cs to the start bit input is all ig nored. therefore, when there is limitation in the bit width of pio of the microcontroller, input 0 before the start bit input, to control the bit width. command mode org=h or open command start bit ope code address data msb of data(dx) is d15 required clocks(n) br93g86-3 msb of address(am) is a9 read (read) *1 1 10 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15~d0(read data) br93g86-3:n=29 write enable (wen) 1 00 1 1 * * * * * * * * br93g86-3:n=13 write disable (wds) 1 00 0 0 * * * * * * * * write (write) *2 1 01 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15~d0(write data) br93g86-3:n=29 write all (wral) *2 1 00 0 1 * * * * * * * * d15~d0(write data) erase (erase) 1 11 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 br93g86-3:n=13 erase all (eral) 1 00 1 0 * * * * * * * * org=l command start bit ope code address data msb of data(dx) is d7 required clocks(n) br93g86-3 msb of address(am) is a 10 read (read) *1 1 10 a10,a9,a 8, a7,a6,a5,a4,a3,a2,a1,a0 d7~d0(read data) br93g86-3:n=22 write enable (wen) 1 00 1 1 * * * * * * * * * br93g86-3:n=14 write disable (wds) 1 00 0 0 * * * * * * * * * write (write) *2 1 01 a10,a9,a 8, a7,a6,a5,a4,a3,a2,a1,a0 d7~d0(write data) br93g86-3:n= 22 write all (wral) *2 1 00 0 1 * * * * * * * * * d7~d0(write data) erase (erase) 1 11 a10,a9,a 8, a7,a6,a5,a4,a3,a2,a1,a0 br93g86-3:n=14 erase all (eral) 1 00 1 0 * * * * * * * * * ? input the address and the data in msb first manners. ? as for *, input either 1 or 0 . *start bit acceptance of all the commands of this ic starts at recognition of the start bit. the start bit means the first 1 input after the rise of cs. *1 as for read, by continuous sk clock input after setting the read comman d, data output of the set address starts, and address data in significant o rder are sequentially output continuously. (auto increment function) *2 for write or write all commands, an internal erase or erase all is includ ed and no separate erase or erase all is needed before write or wr ite all command. (a). connection by 4 lines cs sk do di cs sk d i/o cs sk di do (b). connection by 3 lines cs sk di do cs3 cs2 cs1 sk do di cs sk di do device 1 cs sk di do device 2 cs sk di do device 3 (c). connection example of plural devices figure 34 . connection method with microcontroller micro- controller br93gxx micro- controller micro- controller br93gxx downloaded from: http:///
16 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 timing chart 1) read cycle (read) *1 start bit when data 1 is input for the first time after the rise of cs, this is recognized as a sta rt bit. and when 1 is input after plural 0 are input, it is recognized as a start bit, and the following operation is started. this is common to all the commands to described hereafter. *2 for the meaning of am,dx,n,please see tables of command mode in page 15 . for example, org=h or open,am=a9,dx=d15,n=29. when the read command is recognized, input address data (16bi t or 8bit) is output to serial. and at that moment, at taking a0, in sync with the rise of sk, 0 (dummy bit) is output. and, the following data is output in sync with the rise of sk. this ic has an address auto increment function which is va lid only at read command. this is the function where after the above read execution, by continuously inputting sk clock, th e above address data is read sequentially. and, during the auto increment, keep cs at high. 2) write cycle (write) for the meaning of am,dx,n, please see tables of command mode in pa ge15 . in this command, input 16bit or 8bit data are written to d esignated addresses (am~a0). the actual write starts by the f all of cs of d0 taken sk clock. when status is not detected (cs= low fixed),make sure max 5ms time is in comforming with t e/w . when status is detected (cs= high ), all commands are not accepted for areas where low (busy) is output from do , therefore, do not input any command. 3) write all cycyle (wral) for the meaning of dx, n, please see tables of command mode in page15 . in this command, input 16bit or 8bit data is written simulta neously to all adresses. data is not written continuously per one word but is written in bulk, the write time is only max. 5ms in conformity with t e/w . in wral , status can be detected in the same manner as in write command. cs 1 2 1 4 high-z 1 am a1 a0 0 dx dx-1 d1 dx dx-1 *1 *2 d0 sk di do 0 n n+1 *2 cs 1 2 1 4 high-z 0 am a1 a0 dx dx-1 d1 d0 sk di do 1 n status t cs t sv busy t e/w ready cs 1 2 1 5 high-z 0 0 0 dx dx-1 d1 d0 sk di do n status t cs t sv busy t e/w ready 1 figure 35 . read cycle figure 36 . write cycle figure 37 . write all cycle am: msb of address dx: msb of data n: required clocks am: msb of address dx: msb of data n: required clocks dx: msb of data n: required clocks downloaded from: http:///
17 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4) write enable (wen) / disable (wds) cycle for the meaning of n,please see tables of command mode in page15 . at power on, this ic is in write disable status by the internal reset circuit. before executing the write command, it is necessary to execute the write enable command. and, once this command is executed, it is valid unitl the write disable command is executed or the power is turned off. however, th e read command is valid irrespective of write enable / diable command. input to sk after 6 clocks of this command is avai lable by either 1 or 0 , but be sure to input it. when the write enable command is executed after power on, write enable status gets in. when the write disable command is executed then, the ic gets in write disable sta tus as same as at power on, and then the write command is canceled thereafter in software manner. however, the read comm and is executable. in write enable status, even when the write command is input by mistake, write is started. to prevent such a mistake, it is recommended to execute the write disable command after completion of write. 5) erase cycle (erase) for the meaning of am,n,please see tables of command mode in page15 . in this command, data of the designated address is made into 1 . the data of the designated address becomes ffffh or ffh . actual erase starts at the fall of cs after the fall of a0 taken sk clock. in erase, status can be detected in the same manner as in write command. 6) erase all cycle (eral) for the meaning of n,please see tables of command mode in page15. in this command, data of all addresses is made into 1 . data of all addresses becomes ffffh or ffh . actual erase starts at the fall of cs after the falll of the n-th clock from the start bit input. in eral, status can be detected in the same manner as in wral comman d. figure 38 . write enable (wen) / disable (wds) cycle cs 1 2 1 1 1 4 high-z sk di do status t cs t sv busy t e/w ready am a3 a2 a1 n a0 figure 39 . erase cycle cs 1 2 1 4 high-z sk di do status t cs t sv busy t e/w ready 1 n 0 0 0 figure 40 . erase all cycle cs 1 2 1 5 high-z 0 0 sk di do n 3 4 6 7 8 enable=1 1 disable=0 0 n: required clocks am: msb of address n: required clocks n: required clocks downloaded from: http:///
18 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application 1) method to cancel each command read write,wral erase, eral *1 for the meaning of m,x, please see tables of command mode in p age15 figure 41 . read cancel available timing note 1) if v cc is made off in this area, designated address data is not guaranteed, therefore write once again is suggested. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable, therefore, it is recommended to fall in sk=low area. as for sk rise, recommend timing of t css /t csh or higher. figure 42 . write, wral cancel available timing start bit ope code address data 1bit 2bit m+1bit x+1bit cancel is available in all areas in read mode. ? method to cancel cancel by cs=low *1 a from start bit to the clock rise of d0 taken cancel by cs=low b the clock rise of d0 taken and after cancellation is not available by any means. c n+1 clock rise and after cancel by cs=low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously cancel function is not available. start bit ope code address data t e/w a *1 1bit 2bit m+1bit x+1bit c b *1 for the meaning of m,n, x, please see tables of command mode in page15 *1 figure 43. erase, eral cancel available timing a from start bit to clock rise of a0 taken cancel by cs=low b clock rise of a0 taken cancellation is not available by any means. c n+1 clock rise and after cancel by cs=low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously cancel function is not available. note 1) if v cc is made off in this area, designated address data is not guaranteed, therefore write once again is suggested. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable, therefore, it is recommended to fall in sk=low area. as for sk rise, recommend timing of t css /t csh or higher. *1 for the meaning of m, n, please see table s of command mode in page15 clock rise of a0 taken sk di n-1 a1 n n+1 n+2 b c a enlarged figure a0 clock rise of d0 taken sk di n-1 d1 d0 n n+1 n+2 b enlarged figure c a a1 1bit 2bit m+1bit a c b start bit ope code address t e/w *1 downloaded from: http:///
19 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 2) at standby when cs is low and org is high or open, even if sk,di,do are low , high or with middle electric potential, current does not over i sb1 max. when cs is low , even if sk,di,do and org are low, high or with middle electric potential, current does not over i sb2 max. 3) i/o peripheral circuit 3-1) pull down cs. by making cs=low at power on/off, mistake in operation and mistake wri te are prevented. pull down resistance r cs of cs pin to prevent mistake in operation and mistake write at powe r on/off, cs pull down resistance is necessary. select an appropriate value to this resistance value from microcontroller v oh , i oh , and v il characteristics of this ic. 3-2) do is available in both pull up and pull down. do output always is high-z except in ready / busy status and data outpu t in read command. malfunction may occur when high-z is input to the microcon troller port connected to do, it is necessary to pull down and pull up do. when there is no influence upon the microcontrol ler operations, do may be open. if do is open, and at timing to output status ready, at timing of cs=high, sk=high, di= high , eeprom recognizes this as a start bit, resets ready output, and do=high-z, therefo re, ready signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 45 . ready output timing at do=open figure 44 . cs pull down resistance v ohm i ohm r cs ??? 2.4 2 10 -3 r cs 1.2 [k ] v ohm v ihe ??? r cs example) when v cc =5v, v ihe =2v, v ohm =2.4v, i ohm =2ma, from the equation , ? v ihe ? v ohm ? i ohm with the value of rpd to satisfy the above equation, v ohm becomes 2.4v or higher, and v ihe (=2.0v), the equation is also satisfied. : eeprom vih specifications : microcontroller v oh specifications : microcontroller i oh specifications cs sk di do d0 busy ready high-z enlarged cs sk di do busy high-z improvement by do pull up busy ready cs=sk=di=high when do=open cs=sk=di=high when do=pull up do high microcontroller v ohm high output i ohm r cs v ihe low input eeprom downloaded from: http:///
20 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pull up resistance rpu and pull down resistance rpd of do pin as for pull up and pull down resistance value, select an appro priate value to this resistance value from microcontroller v ih , v il , and v oh , i oh , v ol , i ol characteristics of this ic. ready / busy status display (do terminal) this display outputs the internal status signal. when cs is started after t cs from cs fall after write command input, high or low is output. r/b displ ay low (busy) = write under execution after the timer circuit in the ic works and creates the period of t e/w , this timer circuit completes automatically. and the memory cell is written in the period of t e/w , and during this period, other command is not accepted. r/b display = high (ready) = command wait status after t e/w (max.5ms) the following command is accepted. therefore, cs=high in the period of t e/w , and if signals are input in sk, di, malfunction may occur , therefore, di=low in the area cs=high. (especially, in the case of shared input port, at tention is required.) *do not input any command while status signal is output. command input in busy ar ea is cancelled, but command input in ready area is accepted. therefore, status ready output is cancelled, and malfunction and mistake write may occur. figure 46 . do pull up resistance rpu ??? 5 0.4 2.1 10 -3 rpu 2.2 [k ] v ole v ilm ??? rpu example) when v cc =5v , v ole =0.4v, i ole =2.1ma, v ilm =0.8v, from the equation , v cc v ole i ole with the value of rpu to satisfy the above equation, v ole becomes 0.4v or below, and with v ilm (=0.8v), the equation is also satisfied. rpd ??? 5 0.2 0.1 10 -3 rpd 48 [k ] v ohe v ihm ??? rpd example) when vcc =5v , v ohe =v cc 0.2v, i ohe =0.1ma, v ihm =v cc 0.7v from the equation , v ohe i ohe with the value of rpd to satisfy the above equation, v ohe becomes 2.4v or below, and with v ihm (=3.5v), the equation is also satisfied. figure 47 . do pull down resistance do status do status figure 48 . ready /b usy status output timing chart : eeprom v ol specifications : eeprom i ol specifications : microcontroller v il specifications ? v ole ? i ole ? v ilm : eeprom v oh specifications : eeprom i oh specifications : microcontroller v ih specifications ? v ohe ? i ohe ? v ihm cs high-z sk di do clock write instruction ready status t sv busy t e/w microcontroller v il m low input i o le v ole low output eeprom rpu microcontroller v ih m high input i ohe v ohe high output eeprom rpd downloaded from: http:///
21 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4) when to directly connect di and do this ic has independent input terminal di and outpu t terminal do, and separate signals are handled on timing chart, meanwhile, by inserting a resistance r between thes e di and do terminals, it is possible to carry out control by 1 control line. data collision of microcontroller di/o output and do output and feedback of do output to di input of eeprom. drive from the microcontroller di/o output to di input of eeprom on i/o timing, a nd output signal from do output of eeprom occur at the same time in the following points. 4-1) 1 clock cycle to take in a0 address data at read command dummy bit 0 is output to do terminal. when address data a0 = 1 input, through current route occurs. 4-2) timing of cs = high after write command. do terminal in ready / busy functi on output. when the next start bit input is recognized, high-z gets in. especially, at command input after write, when cs input is started wi th microcontroller di/o output low , ready output high is output from do terminal, and through current route occurs. feedback input at timing of these (4-1) and (4-2) does not c ause disorder in basic operations, if resistance r is ins erted. note) as for the case (4-2), attention must be paid to the following. when status ready is output, do and di are shared, di=high and the microco ntroller di/o=high-z or the microcontroller di/o=high,if sk clock is input, do output is input to di and is recognized as a start bit, and malfunction ma y occur. as a method to avoid malfunction, at status ready output, set sk=low, or start cs within 4 clocks after high of ready signal is o utput. microcontroller di/o port di eeprom do r figure 49 . di , do control line common connection eeprom cs input eeprom sk input eeprom di input eeprom do out put microcontroller di/o port a1 high-z collision of di input and do output high a0 0 dx dx-1 dx-2 a1 a0 high-z microcontroller output microcontroller input figure 50 . collision timing at read data output at di, do direct connection eeprom cs input eeprom sk input eeprom di input eeprom do out put microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output high-z write command write command write command write command microcontroller in put microcontroller output figure 51 . collision timing at di, do direct connection cs sk di do ready high-z start bit because di=high, set sk= low at cs rise. figure. 52 start bit input timing at di, do direct connection *1 *1 for the meaning of x , please see tables of command mode in page15. downloaded from: http:///
22 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 selection of resistance value r the resistance r becomes through current limit resistance at data collision. when through current flows, noises of power source line and instantaneous stop of power sourc e may occur. when allowable through current is defined a s i, the following relation should be satisfied. determine all owable current amount in consideration of impedance and s o forth of power source line in set. and insert resistance r, and set the value r to satisfy eeprom input level v ih /v il even under influence of voltage decline owing to leak current and so forth. insertion of r will not cause any influence upon basic operations. 4-3) address data a0 = 1 input, dummy bit 0 output timing (when microcontroller di/o output is high, eeprom do outputs low , and high is input to di) ? make the through current to eeprom 10ma or below. ? see to it that the level v ih of eeprom should satisfy the following. 4-4) do status ready output timing (when the microcontroller di/o is low , eeprom do output high , and low is input to di) ? set the eeprom input level v il so as to satisfy the following. figure 53 . circuit at di, do direct connection (microcontroller di/o high output, eeprom low output) conditions v ihe i ohm r + v ole at this moment, if v ole =0v, v ihe i ohm r r ??? v ihe i ohm conditions v ile v ohe C i olm r as this moment, v ohe =v cc v ile v cc C i olm r r ??? v cc C v ile i olm figure 54 . circuit at di, do direct connection (microcontroller di/o low output, eeprom high output) example) when v cc =5v, v ohm =5v, i ohm =0.4ma, v olm =5v, i olm =0.4ma, from the equation , from the equation , r r v ihe i ohm 3.5 0.4 10 -3 r 8.75 [k ] ??? r r v cc C v ile i olm 5 C 1.5 2.1 10 -3 r 1.67 [k ] ??? therefore, from the equations and , r 8.75 [k ] : eeprom v ih specifications : eeprom v ol specifications : microcontroller i oh specifications ? v ihe ? v ole ? i ohm : eeprom v il specifications : eeprom v oh specifications : microcontroller i ol specifications ? v ile ? v ohe ? i olm microcontroller di/o port di eeprom do r high output i ohm v ohm v ole low output microcontroller di/o port di eeprom do r low output i olm v olm v ohe high output downloaded from: http:///
23 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 5) i/o equivalence circuit 6) power-up/down conditions at power on/off, set cs low. when cs is high, this ic gets in input accept status (acti ve). if power is turned on in this status, noises and the likes ma y cause malfunction, mistake write or so. to prevent these, at po wer on, set cs low . (when cs is in low status all inputs are cancelled.) and at power decline, owing to power line capacity a nd so forth, low power status may continue long. at this case too, owing to the same reason, malfunction, mistake write may occur, therefore, at power off too, set cs low. por citcuit this ic has a por (power on reset) circuit as a mistake write cou ntermeasure. after por operation, it gets in write disable status. the por circuit is valid only when powe r is on, and does not work when power is off. however, if cs is high at power on/off, it may become write enable status owing to noises and the likes. for secure operations, observe the follwing conditions. 1. set cs= low 2. turn on power so as to satisfy the recommended conditions of t r , t off , vbot for por circuit operation. lvcc circuit lvcc (vcc-lockout) circuit prevents data rewrite operat ion at low power, and prevents wrong write. at lvcc voltage (typ.=1.2v) or below, it prevent data rewrite output circuit do oeint. input citcuit cs csint. reset int. input circuit di cs int. input circuit sk cs int. figure 55 . o utput circuit (do) figure 57 . input circuit (di) figure 56 . input circuit (cs) figure 58 . input circuit (sk) t off t r vbot 0 v cc v cc gnd v cc gnd v cc cs bad example good example figure 59 . timing at power on/off figure 60 . rise waveform diagram bad example cs pin is pulled up to v cc in this case, cs becomes high (active status), and eeprom may have malfu nction, mistake write owing to noise and the likes. even when cs input is high-z, the status becomes like this case, which pleas e note. good example it is low at power on/off. set 10ms or higher to recharge at power off. when power is turned on without observing this condition, ic internal circuit may not be reset, which please note. recommended conditions of t r , t off , vbot t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below downloaded from: http:///
24 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 7)noise countermeasures vcc noise (bypass capacitor) when noise or surge gets in the power source line, malfun ction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1 f) between ic vcc and gnd, at that moment, attach it as close to ic as possible.and, it is also recommended to attach a bypass ca pacitor between board vcc and gnd. sk noise when the rise time of sk is long, and a certain degree or m ore of noise exists, malfunction may occur owing to cloc k bit displacement. to avoid this, a schmitt trigger circuit is buil t in sk input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sk input, set the noise amplitude 0.2vp-p o r below. and it is recommended to set the rise time of sk 100ns or below. in the case when the rise time is 100ns or high er, take sufficient noise co un termeasures. make the clock rise, fall time as small as possible. downloaded from: http:///
25 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes (1) described numeric values and data are design representative va lues, and the values are not guaranteed. (2) we believe that application circuit examples are recomme ndable, however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed n umber of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteri stics and fluctuations of external parts and our lsi. (3) absolute maximum ratings if the absolute maximum ratings such as supply voltage an d operating temperature range and so forth are exceeded, lsi may be destructed. do not impress voltage and temperature exceed ing the absolute maximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should n ot be impressed to lsi. (4) gnd electric potential set the voltage of gnd terminal lowest at any operating condition . make sure that each terminal voltage is not lower than that of gnd terminal in consideration of transition status. (5) heat design in consideration of allowable loss in actual use condition, carry out heat design with sufficient margin. (6) terminal to terminal short circuit and wrong packaging when to package lsi onto a board, pay sufficient attention to lsi direction and displacement. wrong packaging may destruct lsi. and in the case of pin short between lsi termin als and terminals, terminals and power source, terminals and gnd owing to unconnect use, lsi may be destructed. (7) using this lsi in a strong electromagnetic field may cause ma lfunction, therefore, evaluate the design sufficiently. downloaded from: http:///
26 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 part numbering b r 9 3 g 8 6 x x x 3 x x x x x orderable part number package remark type quantity br 93g86 -3 dip- t8 tube of 20 00 not halogen free 100% sn br 93g86f -3gte2 sop8 reel of 25 00 halogen free 100% sn br 93g86 fj -3gte2 sop- j8 reel of 25 00 halogen free 100% sn br 93g86 fv -3gte2 ssop- b8 reel of 25 00 halogen free 100% sn br 93g86fvt -3ge2 tssop- b8 reel of 30 00 halogen free 100% sn br 93g86fvj -3gte2 tssop-b8j reel of 25 00 halogen free 100% sn br 93g86fvm -3gttr msop8 reel of 30 00 halogen free 100% sn br 93g86 nux -3 ttr vson008x2030 reel of 40 00 halogen free 100% sn bus type 93 microwire operating temperature / operating voltage - 40 to +85 / 1.7v to 5.5v process code pin assignment blank: pin1~8: cs, sk, di, do, gnd, org, du, vcc respectively a : pin1~8: cs, sk, di, do, g nd, nc, du, vcc respectively b : pin1~8: du , vcc, cs, sk, di, do, gnd, nc respectively 86=16k capacity package blank :dip- t8 f :sop8 fj :sop- j8 fv :ssop- b8 fvt :tssop- b8 fvj :tssop-b8j fvm :msop8 nux :vson008x2030 packaging and forming specification e2 : embossed tape and reel (sop8,sop-j8, ssop-b8,tssop-b8, tssop-b8j) tr : embossed tape and reel (msop8, vson008x2030) blank : tube (dip-t8) g : halogen free blank: not halogen free as an exception, vson008x2030 package will be halogen free with blank t : 100% sn blank: 100% sn downloaded from: http:///
27 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimensions tape and reel information package name dip- t8 downloaded from: http:///
28 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
29 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name sop-j8 downloaded from: http:///
30 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name ssop- b8 downloaded from: http:///
31 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name tssop- b8 downloaded from: http:///
32 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name tssop-b8j downloaded from: http:///
33 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name msop8 downloaded from: http:///
34 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 package name vson008x2030 downloaded from: http:///
35 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 marking diagrams dip- t8 (top view) br93g86 part number marking lot number sop8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark tssop-b8(top view) part number marking (a0, a1, a2, scl, wp) lot number 1pin mark tssop-b8j(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark 9g 8 6 9g 8 6 9 g e 9 g 86 9g 8 9g e 9g 8 6 3 6 g 3 6 g 3 9g 3 downloaded from: http:///
36 / 36 br93g 86 - 3 www.rohm.com t sz 02201 -09190g100100-1-2 21.dec.2015 rev. 00 2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 21 .jan.2013 001 new release 21 .dec.2015 002 p. 1 change format of package line-up table. p. 2 change remark of power dissipasion. p.26 add the list of part numbering. p.27 correct wrong size of physical dimensions. wrong : the body thickness is 3.4 0.3 correct : the leugth from high side of the body to the stopper of term inal is 3.4 0.3 p. 28 -34 change the format of physical dimensions. downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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